TetraMem Announces 22nm Multi-Level RRAM Analog In-Memory Computing SoC Milestone
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Article Excerpt
SAN JOSE, Calif. — TetraMem Inc., a Silicon Valley–based semiconductor company developing analog in-memory computing (IMC) solutions, today announced the successful tape-out, manufacturing, and initial silicon validation of its MLX200 platform, a 22nm multi-level RRAM-based analog IMC system-on-chip (SoC). TetraMem achieves an MLX200 multi-level RRAM–based in-memory computing SoC milestone on a commercial TSMC 22nm process,...
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Jun 6, 2026